Technical Program

Session	Devices, Characterization & Packaging 3
Date/Time	26 May 2021 / 09:30 - 11:30 hrs
Session Chair/Co-Chair	Prof Nihit Bajaj / Dr Suhaib Ahmed

	Asymmetrical Power Module for Modular Multilevel Converter with Lower Power Loss and Peak Junction Temperature Hua Mao, Huaping Jiang, Jiayu Hu, Li Ran, Yuping Wu, Zhirui Lv and Dawei Yang
	Hybrid Multi-level Clamp for Series-connected IGBT Voltage Balancing ZhiDa Zhou, Donglai Zhang, Chengfei Geng, Wen Shen, Xuanqin Wu, Ruiyong Dong
	Evaluation of a Hybrid Module for Three-Phase Direct Matrix Converter Lei Ming, Wenlong Ding, Ziyang Gao and Poh Chiang Loh
	Analysis of Parallel Current Distribution for PCB based Transformers Mingxiao Li, Ziwei Ouyang, Michael A. E. Andersen and Wenbo Wang